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Санкт-Петербургский центр ЭЛМА организует Международную научно-управленческую конференцию “РУСКОН 2016”
Technological process of organic coating deposition for copper
Technological process of tin stripping off copper conducting pattern.
Technological process of copper etching in ammonical-sulphate solution.
Technological photoresist stripping process after electrodeposited coating operation during tenting process.
Technological process of electrodeposition of two-layer nickel-silver finish coating
Technological process of electrochemical deposition of copper, tin, tin-lead alloy
Technological process of permanganate cleaning of openings in multi-layered printed circuit boards.
Technological process of chemical metallization – ELHM
Technological process of direct metallization and galvanic enwrapping PM300
Technological process of layers treatment in multi-layered printed circuit boards USAD-1100.
Technological process of photoresist and soldering mask development.
Surface treatment before photoresist deposition – MMT1230
Technological process of protective coating deposition for silver.
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