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Permanganate treatment of openings
Additives for copper plating
Ammonia- sulphate etching of copper
Organic protective coating of copper, silver
Chemical copper plating (making current-conducting layer inside opening)
Electrodeposition of nickel-silver
Direct metallization and galvanic enwrapping – current-conducting layer making.
Preparation of MPCB layers for pressing
Surface treatment for photoresist, photoresist deposition and stripping.
Treatment of printed circuit boards’ surface
Antifoaming additives, fibers
Electrodeposition of tin-lead solder
Protective soldering mask – product is under development
Immersion silver plating – product is under development
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